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Flash Memory

Spansion's conventional interface devices feature innovations that help customers develop breakthrough products faster and easier than ever before:

~{!  * Read access times as fast as 45 nanoseconds

~{!  * Support for high-throughput Burst- and Page-mod interfaces

~{!  * Leading-edge 110-nm technology and aggressive cost   reduction roadmap

~{! *  Available with superior price/performance MirrorBit® technology

~{!   * Available in standard packages, including TSOP, SSOP, PLCC

~{!  * Industry leading quality and reliability

 

Datasheet

Multi-Chip-Package (MCP)

Spansion® multi-chip-package solutions enable feature-rich applications in space-constrained designs by combining high-performance Spansion Flash memory and other high-quality memory devices into a single, small, and consistent footprint.

Spansion MCP solutions are ideal for a variety of applications requiring high performance, low power consumption, and a small footprint:

~{!Wireless modems

~{!Cellular handsets

~{!Personal information devices

~{!Handheld PCs

~{!GPS receivers

 

Datasheet