首页 >> 产品展示| Active Components / 主动元器件 >> Memory / 存储器 >> Flash Memory, MCP | |||||||||||||
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Products Description Datasheet Flash Memory Spansion's conventional interface devices feature innovations that help customers develop breakthrough products faster and easier than ever before: ~{!
-Read access times as fast as 45 nanoseconds ~{!
-Support for high-throughput Burst- and Page-mod interfaces ~{!
-Leading-edge 110-nm technology and aggressive cost reduction roadmap
~{!
-Available with superior price/performance MirrorBit® technology ~{! - Available in standard packages, including TSOP, SSOP, PLCC ~{!
- Industry leading quality and reliability Multi-Chip-Package (MCP) Spansion® multi-chip-package solutions enable feature-rich applications in space-constrained designs by combining high-performance Spansion Flash memory and other high-quality memory devices into a single, small, and consistent footprint. Spansion MCP solutions are ideal for a variety of applications requiring high performance, low power consumption, and a small footprint: ~{!
-Wireless
modems
-Cellular handsets
-Personal information devices ~{
-Handheld PCs ~{!
-GPS receivers | |||||||||||||